Browse "CBE-Journal Papers(저널논문)" by Author Bae, SH
Showing results 1 to 2 of 2
| Effects of chemical reaction on the polishing rate and surface planarity in the copper CMP Bae, SH; Yang, Seung-Man; Kim, DoHyun, KOREA-AUSTRALIA RHEOLOGY JOURNAL, v.14, no.2, pp.63 - 70, 2002-06 |
| Preparations of silica slurry for wafer polishing via controlled growth of commercial silica seeds So, JH; Bae, SH; Yang, Seung-Man; Kim, DoHyun, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.18, no.4, pp.547 - 554, 2001-07 |
Discover
Type
- 8,718 Article
- 2 Book
- 1 Book chapter
Open Access
- 325 OA Article
Date issued
- 1,395 2020 - 2024
- 3,297 2010 - 2019
- 2,227 2000 - 2009
- 1,373 1990 - 1999
- 383 1980 - 1989