Preferred Orientation and Morphology of Pb-Sn-Cu Alloy Electro-deposits

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dc.contributor.authorj.-s.kimko
dc.contributor.authorPyun, Su Ilko
dc.contributor.authorh.-k.leeko
dc.date.accessioned2013-02-25T04:31:49Z-
dc.date.available2013-02-25T04:31:49Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1989-07-
dc.identifier.citationPLATING AND SURFACE FINISHING, pp.50 - 54-
dc.identifier.issn0360-3164-
dc.identifier.urihttp://hdl.handle.net/10203/59882-
dc.languageEnglish-
dc.publisherAmerican Electroplaters and Surface Finishers Society, Inc.-
dc.titlePreferred Orientation and Morphology of Pb-Sn-Cu Alloy Electro-deposits-
dc.typeArticle-
dc.type.rimsART-
dc.citation.beginningpage50-
dc.citation.endingpage54-
dc.citation.publicationnamePLATING AND SURFACE FINISHING-
dc.contributor.nonIdAuthorj.-s.kim-
dc.contributor.nonIdAuthorh.-k.lee-
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