DC Field | Value | Language |
---|---|---|
dc.contributor.author | Pyun, Su Il | ko |
dc.contributor.author | m.-h.hong | ko |
dc.date.accessioned | 2013-02-24T14:48:44Z | - |
dc.date.available | 2013-02-24T14:48:44Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1992 | - |
dc.identifier.citation | ELECTROCHIMICA ACTA, v.37, no.13, pp.2437 - 2442 | - |
dc.identifier.issn | 0013-4686 | - |
dc.identifier.uri | http://hdl.handle.net/10203/57992 | - |
dc.description.abstract | The repassivating kinetics of Ni have been investigated by the abrading electrode technique. The early stage of repassivation kinetics of pure nickel have been studied as a function of applied potential and Cl- ion concentration in 0.75 M Na2SO4 solutions of pH 2.8. The applied potential and Cl- ion concentration ranged from -200 to 600 mV(sce) and from 0 to 0.2 M, respectively. Transition time t(T) at which current decay transients intersect for given applied potentials decreased with increasing applied potential. In the absence of the Cl- ion, the current decay rate increased with increasing applied potential from 0 to 600 mV(sce). As the Cl- ion concentration increased at a given applied potential, the current density increased below t(T), whereas it decreased above t(T). The repassivation kinetics with respect to the Cl- ion have been discussed in terms of competitive adsorption of Cl- and OH-/O2- ions. As a result it is suggested that below t(T), the increased current density by the addition of Cl- ion is caused by the preferential adsorption of Cl- ion and the inhibition of the adsorption of OH- ion on the nickel surface. Above t(T), the decreased current density by the addition of Cl- ion is based upon the fact that the adsorbed Cl- ion facilitates the place exchange reaction between metal and hydroxyl ions, and hence the film formation. | - |
dc.language | English | - |
dc.publisher | Pergamon-Elsevier Science Ltd | - |
dc.subject | PASSIVATING FILMS | - |
dc.subject | ALKALINE-SOLUTION | - |
dc.subject | STRESS-CORROSION | - |
dc.subject | STAINLESS-STEEL | - |
dc.subject | COPPER-ALLOYS | - |
dc.subject | OXIDE FILM | - |
dc.subject | CHLORIDE | - |
dc.subject | GROWTH | - |
dc.subject | IRON | - |
dc.title | The Repassivation Kinetics of Pure Nickel in Na2SO4 Solution Using Abrading Electrode Technique | - |
dc.type | Article | - |
dc.identifier.wosid | A1992JN63200008 | - |
dc.identifier.scopusid | 2-s2.0-0000824070 | - |
dc.type.rims | ART | - |
dc.citation.volume | 37 | - |
dc.citation.issue | 13 | - |
dc.citation.beginningpage | 2437 | - |
dc.citation.endingpage | 2442 | - |
dc.citation.publicationname | ELECTROCHIMICA ACTA | - |
dc.contributor.nonIdAuthor | m.-h.hong | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | REPASSIVATION KINETICS OF NI | - |
dc.subject.keywordAuthor | ABRADING ELECTRODE TECHNIQUE | - |
dc.subject.keywordAuthor | APPLIED POTENTIAL | - |
dc.subject.keywordAuthor | CL-ION CONCENTRATION | - |
dc.subject.keywordAuthor | TRANSITION TIME IN CURRENT DECAY TRANSIENTS | - |
dc.subject.keywordPlus | PASSIVATING FILMS | - |
dc.subject.keywordPlus | ALKALINE-SOLUTION | - |
dc.subject.keywordPlus | STRESS-CORROSION | - |
dc.subject.keywordPlus | STAINLESS-STEEL | - |
dc.subject.keywordPlus | COPPER-ALLOYS | - |
dc.subject.keywordPlus | OXIDE FILM | - |
dc.subject.keywordPlus | CHLORIDE | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | IRON | - |
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