웨이퍼 가공기의 진동 해석 및 실험적 검증Vibration Analysis of Wafer Cutting Machine and its Experimental Verification

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dc.contributor.author김명업ko
dc.contributor.author임경화ko
dc.contributor.author이종원ko
dc.date.accessioned2013-02-24T13:01:49Z-
dc.date.available2013-02-24T13:01:49Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1992-01-
dc.identifier.citation대한기계학회논문집 A, v.16, no.1, pp.22 - 30-
dc.identifier.issn1226-4873-
dc.identifier.urihttp://hdl.handle.net/10203/57332-
dc.description.abstractThe free vibrations of the outer-clamped spinning annular disk which simulates a wafer cutting machine are investigated. The effects of the initial tension, the centrifugal force and outer-fixture extension caused by spinning on the vibration characteristics of the disk are considered. The modal parameters of the disk are calculated by using Galerkins method as the rotating speed and initial tension are varied. Laboratory experiments are also performed with a rotating and stationary disk, and, it is found that experimental and simulation results are in good agreement.-
dc.languageKorean-
dc.publisher대한기계학회-
dc.title웨이퍼 가공기의 진동 해석 및 실험적 검증-
dc.title.alternativeVibration Analysis of Wafer Cutting Machine and its Experimental Verification-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume16-
dc.citation.issue1-
dc.citation.beginningpage22-
dc.citation.endingpage30-
dc.citation.publicationname대한기계학회논문집 A-
dc.contributor.localauthor이종원-
dc.contributor.nonIdAuthor김명업-
dc.contributor.nonIdAuthor임경화-
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ME-Journal Papers(저널논문)
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