THE DIRECT BONDING BETWEEN COPPER AND MGO-DOPED SI3N4
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | KIM, ST | ko |
| dc.contributor.author | Kim, Chong Hee | ko |
| dc.contributor.author | PARK, JY | ko |
| dc.contributor.author | SON, YB | ko |
| dc.contributor.author | KIM, KY | ko |
| dc.date.accessioned | 2013-02-24T09:20:23Z | - |
| dc.date.available | 2013-02-24T09:20:23Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1990-12 | - |
| dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE, v.25, no.12, pp.5185 - 5191 | - |
| dc.identifier.issn | 0022-2461 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/56029 | - |
| dc.language | English | - |
| dc.publisher | CHAPMAN HALL LTD | - |
| dc.title | THE DIRECT BONDING BETWEEN COPPER AND MGO-DOPED SI3N4 | - |
| dc.type | Article | - |
| dc.identifier.wosid | A1990EL99200040 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 25 | - |
| dc.citation.issue | 12 | - |
| dc.citation.beginningpage | 5185 | - |
| dc.citation.endingpage | 5191 | - |
| dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE | - |
| dc.identifier.doi | 10.1007/BF00580149 | - |
| dc.contributor.nonIdAuthor | KIM, ST | - |
| dc.contributor.nonIdAuthor | PARK, JY | - |
| dc.contributor.nonIdAuthor | SON, YB | - |
| dc.contributor.nonIdAuthor | KIM, KY | - |
| dc.type.journalArticle | Article | - |
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