A new spectral imaging ellipsometer for measuring the thickness of patterned thin films

Abstract

We proposed spectral imaging ellipsometry that uniquely combines one-dimensional imaging and spectroscopic ellipsometry. This type of ellipsometry enables the measurement of the optical parameters and dimensional structures of patterned or multilayered thin films. We demonstrated the result of the measurement of the thickness of patterned SiO2 layers with 3 nm Short Note accuracy and 200 mum spatial resolution.