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Showing results 4 to 7 of 7

4
Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics

Lee, Gun-Hee; Kim, Hyeonji; Lee, Juhyun; Bae, Jae-Young; Yang, Congqi; Kim, Hanul; Kang, Heemin; et al, MATERIALS TODAY, v.67, pp.84 - 94, 2023-07

5
Materials and Wireless Microfluidic Systems for Electronics Capable of Chemical Dissolution on Demand

Lee, Chi Hwan; Jeong, Jae-Woong; Liu, Yuhao; Zhang, Yihui; Shi, Yan; Kang, Seung-Kyun; Kim, Jeonghyun; et al, ADVANCED FUNCTIONAL MATERIALS, v.25, no.9, pp.1338 - 1343, 2015-03

6
Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics

Lee, Gun-Hee; Lee, Ye Rim; Kim, Hanul; Kwon, Do A.; Kim, Hyeonji; Yang, Congqi; Choi, Siyoung Q.; et al, NATURE COMMUNICATIONS, v.13, no.1, 2022-05

7
Skin preparation-free, stretchable microneedle adhesive patches for reliable electrophysiological sensing and exoskeleton robot control

Kim, Heesoo; Lee, Juhyun; Heo, Ung; Jayashankar, Dhileep Kumar; Agno, Karen-Christian; Kim, Yeji; Kim, Choongyeon; et al, SCIENCE ADVANCES, v.10, no.3, 2024-01

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