DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, J. | - |
dc.contributor.author | Kam, D.G. | - |
dc.contributor.author | Chung, D. | - |
dc.contributor.author | Srinivasan, K. | - |
dc.contributor.author | Govind, V. | - |
dc.contributor.author | Kim, Joungho | - |
dc.contributor.author | Swaminathan, M. | - |
dc.date.accessioned | 2007-06-20T01:32:30Z | - |
dc.date.available | 2007-06-20T01:32:30Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-10-24 | - |
dc.identifier.citation | 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, no., pp.69 - 72 | - |
dc.identifier.uri | http://hdl.handle.net/10203/520 | - |
dc.language | ENG | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-33845883772 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 2005 | - |
dc.citation.beginningpage | 69 | - |
dc.citation.endingpage | 72 | - |
dc.citation.publicationname | 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Choi, J. | - |
dc.contributor.nonIdAuthor | Kam, D.G. | - |
dc.contributor.nonIdAuthor | Chung, D. | - |
dc.contributor.nonIdAuthor | Srinivasan, K. | - |
dc.contributor.nonIdAuthor | Govind, V. | - |
dc.contributor.nonIdAuthor | Swaminathan, M. | - |
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