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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications

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dc.contributor.authorChoi, J.-
dc.contributor.authorKam, D.G.-
dc.contributor.authorChung, D.-
dc.contributor.authorSrinivasan, K.-
dc.contributor.authorGovind, V.-
dc.contributor.authorKim, Joungho-
dc.contributor.authorSwaminathan, M.-
dc.date.accessioned2007-06-20T01:32:30Z-
dc.date.available2007-06-20T01:32:30Z-
dc.date.created2012-02-06-
dc.date.issued2005-10-24-
dc.identifier.citation14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, no., pp.69 - 72-
dc.identifier.urihttp://hdl.handle.net/10203/520-
dc.languageENG-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleNear field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications-
dc.typeConference-
dc.identifier.scopusid2-s2.0-33845883772-
dc.type.rimsCONF-
dc.citation.volume2005-
dc.citation.beginningpage69-
dc.citation.endingpage72-
dc.citation.publicationname14th Topical Meeting on Electrical Performance of Electronic Packaging 2005-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorChoi, J.-
dc.contributor.nonIdAuthorKam, D.G.-
dc.contributor.nonIdAuthorChung, D.-
dc.contributor.nonIdAuthorSrinivasan, K.-
dc.contributor.nonIdAuthorGovind, V.-
dc.contributor.nonIdAuthorSwaminathan, M.-
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EE-Conference Papers(학술회의논문)
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