학위논문(석사) - 한국과학기술원 : 신소재공학과, 2005.2, [ viii, 70 p. ]
하부금속층; 공정 80Au-20Sn 솔더; 전자패키징 수신기 검증 도구; electronic packagingeceiver ation tool2.6tion; under bump metallurgy; Eutectic 80Au-20Sn solder
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.