전해도금을 이용한 미세 피치 Au bump 제조 방법 및 접합에 관한 연구 = Fabrication and bonding of fine pitch Au bump by electroplating

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Advisors
유진researcherYu, Jinresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2004
Identifier
238338/325007  / 020023632
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 신소재공학과, 2004.2, [ viii, 76 p. ]

Keywords

본딩; 3차원 패키징; 패키징; 골드 범프; 파인피치범프; FINE PITCH BUMP; BONDING; 3D PACKAGING; PACKAGING; AU BUMP

URI
http://hdl.handle.net/10203/51624
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=238338&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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