Dry film photoresist를 이용한 인쇄회로기판용 인듐 솔더 범프 형성 및 플립칩 패키지의 마이크로파 주파수 특성 측정 = Formation of indium solder bumps on printed circuit board using dry film photoresist and microwave frequency measurement of flip chip package

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Advisors
전덕영researcherJeon, Duk-Youngresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2004
Identifier
238331/325007  / 020023470
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 신소재공학과, 2004.2, [ iv, 81 p. ]

Keywords

마이크로파; 테프론; 인듐솔더범프; 플립칩; DRY FILM PHOTORESIST; MICROWAVE; PTFE; INDIUM SOLDER BUMP; FLIP CHIP

URI
http://hdl.handle.net/10203/51617
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=238331&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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