폴리이미드 위에 스퍼터 증착한 Cr 및 Cu 박막의 잔류응력에 관한 연구 = A study on the residual stress of Cr & Cu thin films sputtered onto polyimide

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Advisors
유진researcherYu, Jinresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
1996
Identifier
107105/325007 / 000947003
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 신소재공학과, 1996.2, [ v, 58 p. ]

Keywords

미세구조; 전처리; 잔류응력; Adhesion; Grain-like crack; RF treatment; Residual stress

URI
http://hdl.handle.net/10203/51564
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=107105&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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