학위논문(석사) - 한국과학기술원 : 신소재공학과, 2009.2, [ vii, 45 p. ]
Electromigration; Current stress; Kirkendall void; Electroplating; Solder; 일렉트로마이그래이션; 전류 응력; 커켄달보이드; 전기도금; 무연솔더
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