실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구 = A study on the Co-Sn IMCs for the silicon wafer bonding

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Advisors
유진researcherYu, Jinresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2008
Identifier
296351/325007  / 020063078
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 신소재공학과, 2008.2, [ vi, 67 p. ]

Keywords

웨이퍼 접합; 금속간화합물; 코발트-주석; 패키징; 계면반응; wafer bonding; IMCs; cobalt-tin; packaging; interfacial reaction

URI
http://hdl.handle.net/10203/51296
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=296351&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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