Via-hole filling을 위한 텅스텐 저압화학증착에 관한 연구A study on the low pressure chemical vapor deposition of tungsten for via-hole filling

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dc.contributor.advisor천성순-
dc.contributor.advisorChun, Soung-Soon-
dc.contributor.author김일-
dc.contributor.authorKim, Il-
dc.date.accessioned2011-12-15T01:39:59Z-
dc.date.available2011-12-15T01:39:59Z-
dc.date.issued1990-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=68028&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/51212-
dc.description학위논문(석사) - 한국과학기술원 : 재료공학과, 1990, [ [iii], 67 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.titleVia-hole filling을 위한 텅스텐 저압화학증착에 관한 연구-
dc.title.alternativeA study on the low pressure chemical vapor deposition of tungsten for via-hole filling-
dc.typeThesis(Master)-
dc.identifier.CNRN68028/325007-
dc.description.department한국과학기술원 : 재료공학과, -
dc.identifier.uid000891089-
dc.contributor.localauthor천성순-
dc.contributor.localauthorChun, Soung-Soon-
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MS-Theses_Master(석사논문)
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