인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화Optimization of flip chip bonding for a VCSEL array using indium bumps
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 전덕영 | - |
| dc.contributor.advisor | Jeon, Duk-Young | - |
| dc.contributor.author | 주건모 | - |
| dc.contributor.author | Chu, Kun-Mo | - |
| dc.date.accessioned | 2011-12-15T01:35:17Z | - |
| dc.date.available | 2011-12-15T01:35:17Z | - |
| dc.date.issued | 2003 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=180283&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50919 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 94 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 솔더댐 | - |
| dc.subject | 광연결 | - |
| dc.subject | 플립칩 | - |
| dc.subject | 인듐솔더범프 | - |
| dc.subject | 수직공진형 표면방출레이저 | - |
| dc.subject | 은 | - |
| dc.subject | silver | - |
| dc.subject | UBM | - |
| dc.subject | optical interconnection | - |
| dc.subject | flip chip | - |
| dc.subject | indium solder bump | - |
| dc.subject | VCSEL | - |
| dc.title | 인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화 | - |
| dc.title.alternative | Optimization of flip chip bonding for a VCSEL array using indium bumps | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 180283/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 020013587 | - |
| dc.contributor.localauthor | 전덕영 | - |
| dc.contributor.localauthor | Jeon, Duk-Young | - |
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