스텐실 프린팅법에 의한 미세 피치 솔더 범프 제조Fine pitch solder bump fabrication by stencil printing method
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유진 | - |
| dc.contributor.advisor | Yu, Jin | - |
| dc.contributor.author | 심재황 | - |
| dc.contributor.author | Sim, Jae-Hwang | - |
| dc.date.accessioned | 2011-12-15T01:34:54Z | - |
| dc.date.available | 2011-12-15T01:34:54Z | - |
| dc.date.issued | 2003 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=180260&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50896 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ v, 61 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 스텐실 프린팅 | - |
| dc.subject | 솔더 범프 | - |
| dc.subject | Solder Bump | - |
| dc.subject | stencil printing | - |
| dc.title | 스텐실 프린팅법에 의한 미세 피치 솔더 범프 제조 | - |
| dc.title.alternative | Fine pitch solder bump fabrication by stencil printing method | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 180260/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 020013320 | - |
| dc.contributor.localauthor | 유진 | - |
| dc.contributor.localauthor | Yu, Jin | - |
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- MS-Theses_Master(석사논문)
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