Stencil printing으로 형성한 Pb-free solder bump와 UBM(under bump metallurgy) 간의 계면에 관한 연구Interfacil studies on the stencil printed Pb-free solder bump and UBM (under bump metallurgy)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이원종 | - |
| dc.contributor.advisor | Lee, Won-Jong | - |
| dc.contributor.author | 엄지용 | - |
| dc.contributor.author | Eom, Ji-Yong | - |
| dc.date.accessioned | 2011-12-15T01:33:02Z | - |
| dc.date.available | 2011-12-15T01:33:02Z | - |
| dc.date.issued | 2000 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=158611&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50784 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 2000.2, [ v, 101 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 금속간 화합물 | - |
| dc.subject | 하부 금속층 | - |
| dc.subject | 무연 솔더 범프 | - |
| dc.subject | 스탠실 프린팅 | - |
| dc.subject | 파단면 | - |
| dc.subject | Fractured interface | - |
| dc.subject | Intermetallic compound | - |
| dc.subject | UBM | - |
| dc.subject | Pb-free solder bump | - |
| dc.subject | Stencil printing | - |
| dc.title | Stencil printing으로 형성한 Pb-free solder bump와 UBM(under bump metallurgy) 간의 계면에 관한 연구 | - |
| dc.title.alternative | Interfacil studies on the stencil printed Pb-free solder bump and UBM (under bump metallurgy) | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 158611/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000983336 | - |
| dc.contributor.localauthor | 이원종 | - |
| dc.contributor.localauthor | Lee, Won-Jong | - |
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- MS-Theses_Master(석사논문)
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