학위논문(석사) - 한국과학기술원 : 재료공학과, 2000.2, [ v, 101 p. ]
금속간 화합물; 하부 금속층; 무연 솔더 범프; 스탠실 프린팅; 파단면; Fractured interface; Intermetallic compound; UBM; Pb-free solder bump; Stencil printing
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