극박 동박 제조 공정중 Cr 도금 표면이 Cu/Cr층의 Cu 전착 거동에 미치는 영향A study on the effects of the Cr electrodeposition layer on the Cu electrodeposit behavior of the Cu/Cr layer for UTC process
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 권혁상 | - |
| dc.contributor.advisor | Kwon, Hyuk-Sang | - |
| dc.contributor.author | 김기태 | - |
| dc.contributor.author | Kim, Ki-Tae | - |
| dc.date.accessioned | 2011-12-15T01:32:41Z | - |
| dc.date.available | 2011-12-15T01:32:41Z | - |
| dc.date.issued | 2000 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=158590&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50763 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 2000.2, [ ix, 84 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 양극 처리 | - |
| dc.subject | 음극 처리 | - |
| dc.subject | 구리 도금 | - |
| dc.subject | 크롬 도금 | - |
| dc.subject | 극박 동박 | - |
| dc.subject | UTC | - |
| dc.subject | Anodizing | - |
| dc.subject | Cathodizing | - |
| dc.subject | Cu electrodeposition | - |
| dc.subject | Cr electrodeposition | - |
| dc.title | 극박 동박 제조 공정중 Cr 도금 표면이 Cu/Cr층의 Cu 전착 거동에 미치는 영향 | - |
| dc.title.alternative | A study on the effects of the Cr electrodeposition layer on the Cu electrodeposit behavior of the Cu/Cr layer for UTC process | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 158590/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000983063 | - |
| dc.contributor.localauthor | 권혁상 | - |
| dc.contributor.localauthor | Kwon, Hyuk-Sang | - |
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