극박 동박 제조 공정중 Cr 도금 표면이 Cu/Cr층의 Cu 전착 거동에 미치는 영향A study on the effects of the Cr electrodeposition layer on the Cu electrodeposit behavior of the Cu/Cr layer for UTC process
- Advisors
- 권혁상researcher; Kwon, Hyuk-Sangresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2000
- Identifier
- 158590/325007 / 000983063
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 2000.2, [ ix, 84 p. ]
- Keywords
양극 처리; 음극 처리; 구리 도금; 크롬 도금; 극박 동박; UTC; Anodizing; Cathodizing; Cu electrodeposition; Cr electrodeposition
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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