Cu 확산 방지용 TiN의 stuffing 효과에 관한 연구A study on the effect of TiN stuffing for Cu diffusion barrier

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dc.contributor.advisor박종욱-
dc.contributor.advisorPark, Chong-Ook-
dc.contributor.author황용섭-
dc.contributor.authorHwang, Yong-Sup-
dc.date.accessioned2011-12-15T01:31:33Z-
dc.date.available2011-12-15T01:31:33Z-
dc.date.issued1998-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=133570&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/50694-
dc.description학위논문(석사) - 한국과학기술원 : 재료공학과, 1998.2, [ 67 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subject확산 방지막-
dc.subject충진 효과-
dc.subjectTiN-
dc.subjectDiffusion barrier-
dc.subjectStuffing-
dc.titleCu 확산 방지용 TiN의 stuffing 효과에 관한 연구-
dc.title.alternativeA study on the effect of TiN stuffing for Cu diffusion barrier-
dc.typeThesis(Master)-
dc.identifier.CNRN133570/325007-
dc.description.department한국과학기술원 : 재료공학과, -
dc.identifier.uid000963671-
dc.contributor.localauthor박종욱-
dc.contributor.localauthorPark, Chong-Ook-
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MS-Theses_Master(석사논문)
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