열산화된 리드프레임과 EMC와의 접착력에 관한 연구A study on the adhesion between thermally oxidized leadframe and epoxy molding compounds
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유진 | - |
| dc.contributor.advisor | Yu, Jin | - |
| dc.contributor.author | 신승우 | - |
| dc.contributor.author | Shin, Seung-Woo | - |
| dc.date.accessioned | 2011-12-15T01:30:58Z | - |
| dc.date.available | 2011-12-15T01:30:58Z | - |
| dc.date.issued | 1997 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=128152&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50659 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 1997.8, [ iii, 55 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 접착력 | - |
| dc.subject | 봉지재 | - |
| dc.subject | 리드 프레임 | - |
| dc.subject | 산화 | - |
| dc.subject | 실장 | - |
| dc.subject | Packaging | - |
| dc.subject | Adhesion | - |
| dc.subject | EMC | - |
| dc.subject | Lead frame | - |
| dc.subject | Oxidation | - |
| dc.title | 열산화된 리드프레임과 EMC와의 접착력에 관한 연구 | - |
| dc.title.alternative | A study on the adhesion between thermally oxidized leadframe and epoxy molding compounds | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 128152/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000957510 | - |
| dc.contributor.localauthor | 유진 | - |
| dc.contributor.localauthor | Yu, Jin | - |
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