CMP의 기계적 공정 변수가 반도체 표면 평탄화의 균일도에 미치는 영향A effect of the mechanical factors on the uniformity in the chemical-mechanical polishing(CMP) of $SiO_2$ thin film
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 강상원 | - |
| dc.contributor.advisor | Kang, Sang-Won | - |
| dc.contributor.author | 김우찬 | - |
| dc.contributor.author | Kim, Woo-Chan | - |
| dc.date.accessioned | 2011-12-15T01:29:29Z | - |
| dc.date.available | 2011-12-15T01:29:29Z | - |
| dc.date.issued | 1996 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=106163&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50570 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 1996.2, [ iv, 62 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 균일도 | - |
| dc.subject | 화학기계적 연마 | - |
| dc.subject | 연마속도 | - |
| dc.subject | Polishing rate | - |
| dc.subject | Uniformity | - |
| dc.subject | CMP | - |
| dc.title | CMP의 기계적 공정 변수가 반도체 표면 평탄화의 균일도에 미치는 영향 | - |
| dc.title.alternative | A effect of the mechanical factors on the uniformity in the chemical-mechanical polishing(CMP) of $SiO_2$ thin film | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 106163/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000943097 | - |
| dc.contributor.localauthor | 강상원 | - |
| dc.contributor.localauthor | Kang, Sang-Won | - |
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