CMP의 기계적 공정 변수가 반도체 표면 평탄화의 균일도에 미치는 영향A effect of the mechanical factors on the uniformity in the chemical-mechanical polishing(CMP) of $SiO_2$ thin film
- Advisors
- 강상원researcher; Kang, Sang-Wonresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1996
- Identifier
- 106163/325007 / 000943097
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 1996.2, [ iv, 62 p. ]
- Keywords
균일도; 화학기계적 연마; 연마속도; Polishing rate; Uniformity; CMP
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.