Cu 또는 Bi 첨가가 Sn-3.5Ag계 무연 솔더 합금의 크리프 특성에 미치는 영향Effects of Cu or Bi addition to the creep properties of Sn-3.5Ag based lead-free solder alloys
- Advisors
- 유진researcher; Yu, Jinresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2003
- Identifier
- 231100/325007 / 000985196
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 재료공학과, 2003.8, [ viii, 116 p. ]
- Keywords
creep; Sn; solder; lead-free; lapshear; 랩시어; 크리프; 주석; 솔더; 무연
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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