전자부품 실장용 Sn-Ag-X 계 솔더 합금의 계면 현상과 특성 평가Interfacial phenomena and characterization of Sn-Ag-based solder alloy systems for electronic packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이혁모 | - |
| dc.contributor.advisor | Lee, Hyuck-Mo | - |
| dc.contributor.author | 최원경 | - |
| dc.contributor.author | Choi, Won-Kyoung | - |
| dc.date.accessioned | 2011-12-15T01:06:53Z | - |
| dc.date.available | 2011-12-15T01:06:53Z | - |
| dc.date.issued | 2001 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=165778&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50414 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 2001.2, [ vii, 200 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 계면 | - |
| dc.subject | 은 | - |
| dc.subject | 주석 | - |
| dc.subject | 솔더 | - |
| dc.subject | solder | - |
| dc.subject | interface | - |
| dc.subject | Ag | - |
| dc.subject | Sn | - |
| dc.subject | packaging | - |
| dc.title | 전자부품 실장용 Sn-Ag-X 계 솔더 합금의 계면 현상과 특성 평가 | - |
| dc.title.alternative | Interfacial phenomena and characterization of Sn-Ag-based solder alloy systems for electronic packaging | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 165778/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000975395 | - |
| dc.contributor.localauthor | 최원경 | - |
| dc.contributor.localauthor | Choi, Won-Kyoung | - |
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
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