전자부품 실장용 Sn-Ag-X 계 솔더 합금의 계면 현상과 특성 평가 = Interfacial phenomena and characterization of Sn-Ag-based solder alloy systems for electronic packaging

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Advisors
이혁모researcherLee, Hyuck-Moresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
2001
Identifier
165778/325007 / 000975395
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 2001.2, [ vii, 200 p. ]

Keywords

계면; 은; 주석; 솔더; solder; interface; Ag; Sn; packaging

URI
http://hdl.handle.net/10203/50414
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=165778&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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