전자부품 실장용 Sn-Ag-X 계 솔더 합금의 계면 현상과 특성 평가Interfacial phenomena and characterization of Sn-Ag-based solder alloy systems for electronic packaging
- Advisors
- 이혁모researcher; Lee, Hyuck-Moresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2001
- Identifier
- 165778/325007 / 000975395
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 재료공학과, 2001.2, [ vii, 200 p. ]
- Keywords
계면; 은; 주석; 솔더; solder; interface; Ag; Sn; packaging
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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