반도체 배선용 Cu 박막의 reflow 및 응집 특성Reflow and agglomeration of Cu thin films for the interconnect in semiconductor devices
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 박종욱 | - |
| dc.contributor.advisor | Park, Chong-Ook | - |
| dc.contributor.author | 이승윤 | - |
| dc.contributor.author | Lee, Seung-Yun | - |
| dc.date.accessioned | 2011-12-15T01:06:05Z | - |
| dc.date.available | 2011-12-15T01:06:05Z | - |
| dc.date.issued | 1999 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=156001&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50366 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 1999.8, [ iii, 120 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 산화 | - |
| dc.subject | 응집 | - |
| dc.subject | 배선 | - |
| dc.subject | 구리 | - |
| dc.subject | 입자성장 | - |
| dc.subject | Grain growth | - |
| dc.subject | Oxidation | - |
| dc.subject | Agglomeration | - |
| dc.subject | Reflow | - |
| dc.subject | Cu | - |
| dc.title | 반도체 배선용 Cu 박막의 reflow 및 응집 특성 | - |
| dc.title.alternative | Reflow and agglomeration of Cu thin films for the interconnect in semiconductor devices | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 156001/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000965287 | - |
| dc.contributor.localauthor | 이승윤 | - |
| dc.contributor.localauthor | Lee, Seung-Yun | - |
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