리드프레임과 EMC의 접착에 관한 연구A study on the adhesion of leadframe to EMC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유진 | - |
| dc.contributor.advisor | Yu, Jin | - |
| dc.contributor.author | 이호영 | - |
| dc.contributor.author | Lee, Ho-Young | - |
| dc.date.accessioned | 2011-12-15T01:05:50Z | - |
| dc.date.available | 2011-12-15T01:05:50Z | - |
| dc.date.issued | 1999 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=150165&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50352 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 1999.2, [ xi, 162 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 흑색 산화물 | - |
| dc.subject | 갈색 산화물 | - |
| dc.subject | 하중조건 | - |
| dc.subject | 접착강도 | - |
| dc.subject | 팝콘균열 | - |
| dc.subject | 에폭시 봉지재 | - |
| dc.subject | 리드프레임 | - |
| dc.subject | 파괴경로 | - |
| dc.subject | Failure path | - |
| dc.subject | Black oxide | - |
| dc.subject | Brown oxide | - |
| dc.subject | Loading condition | - |
| dc.subject | Adhesion strength | - |
| dc.subject | Popcorn crack | - |
| dc.subject | Leadframe | - |
| dc.subject | Epoxy molding compound | - |
| dc.title | 리드프레임과 EMC의 접착에 관한 연구 | - |
| dc.title.alternative | A study on the adhesion of leadframe to EMC | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 150165/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000949008 | - |
| dc.contributor.localauthor | 이호영 | - |
| dc.contributor.localauthor | Lee, Ho-Young | - |
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- MS-Theses_Ph.D.(박사논문)
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