반도체 배선용 구리 전기도금막의 Self-annealing 기구분석 = Analysis of self-annealing mechanism in electroplated Cu thin film for the interconnect of semiconductor devices

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Advisors
박종욱researcherPark, Chong-Ookresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
2003
Identifier
181084/325007 / 000975303
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 155 p. ]

Keywords

결정립 성장; 반도체; 전기도금; 구리; 응력; Stress; Semiconductor; Self-annealing; Electroplating; Copper

URI
http://hdl.handle.net/10203/50279
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=181084&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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