반도체 배선용 구리 전기도금막의 Self-annealing 기구분석Analysis of self-annealing mechanism in electroplated Cu thin film for the interconnect of semiconductor devices
- Advisors
- 박종욱researcher; Park, Chong-Ookresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2003
- Identifier
- 181084/325007 / 000975303
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 155 p. ]
- Keywords
결정립 성장; 반도체; 전기도금; 구리; 응력; Stress; Semiconductor; Self-annealing; Electroplating; Copper
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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