Cu 확산방지용 TCP MOCVD Ta(Si)N 박막 증착 및 특성에 관한 연구 = Deposition and characterization of TCP MOCVD Ta(Si)N thin films as diffusion barrier for Cu

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dc.contributor.advisor이원종-
dc.contributor.advisorLee, Won-Jong-
dc.contributor.author박혜련-
dc.contributor.authorPark, Hye-Lyun-
dc.date.accessioned2011-12-15T01:04:30Z-
dc.date.available2011-12-15T01:04:30Z-
dc.date.issued2002-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=177284&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/50270-
dc.description학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.2, [ ii, 113 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subject유도결합플라즈마-
dc.subject확산방지막-
dc.subjectTaSiN-
dc.subjectTaN-
dc.subject금속유기물화학증착법-
dc.subjectMOCVD-
dc.subjecttransformer coupled plasma-
dc.subjectdiffusion barrier-
dc.subjectTaSiN-
dc.subjectTaN-
dc.titleCu 확산방지용 TCP MOCVD Ta(Si)N 박막 증착 및 특성에 관한 연구 = Deposition and characterization of TCP MOCVD Ta(Si)N thin films as diffusion barrier for Cu-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN177284/325007-
dc.description.department한국과학기술원 : 재료공학과, -
dc.identifier.uid000955155-
dc.contributor.localauthor박혜련-
dc.contributor.localauthorPark, Hye-Lyun-
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MS-Theses_Ph.D.(박사논문)
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