전자패키징용 $SiC_p/Al$ 금속복합재료의 제조공정 및 열적특성 = Fabrication process and thermal properties of $SiC_p/Al$ metal matrix composites for electronic packaging applications

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dc.contributor.advisor홍순형-
dc.contributor.advisorHong, Soon-Hyung-
dc.contributor.author이효수-
dc.contributor.authorLee, Hyo-Soo-
dc.date.accessioned2011-12-15T01:04:01Z-
dc.date.available2011-12-15T01:04:01Z-
dc.date.issued2002-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=174582&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/50242-
dc.description학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.2, [ xvi, 199 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subject열전도도-
dc.subjectSiCp/Al 금속복합재료-
dc.subjectSiC 분말 예비성형체-
dc.subject전자패키징용 열관리 재료-
dc.subject열팽창계수-
dc.subjectThermal Expansion Coefficient-
dc.subjectThermal Conductivity-
dc.subjectSiCp/Al Metal Matrix Compoiste-
dc.subjectSiC Particulate Preform-
dc.subjectThermal Management Materials for Elelctronic Packaging-
dc.title전자패키징용 $SiC_p/Al$ 금속복합재료의 제조공정 및 열적특성 = Fabrication process and thermal properties of $SiC_p/Al$ metal matrix composites for electronic packaging applications-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN174582/325007-
dc.description.department한국과학기술원 : 재료공학과, -
dc.identifier.uid000965332-
dc.contributor.localauthor이효수-
dc.contributor.localauthorLee, Hyo-Soo-
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MS-Theses_Ph.D.(박사논문)
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