전자패키징용 $SiC_p/Al$ 금속복합재료의 제조공정 및 열적특성Fabrication process and thermal properties of $SiC_p/Al$ metal matrix composites for electronic packaging applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 홍순형 | - |
| dc.contributor.advisor | Hong, Soon-Hyung | - |
| dc.contributor.author | 이효수 | - |
| dc.contributor.author | Lee, Hyo-Soo | - |
| dc.date.accessioned | 2011-12-15T01:04:01Z | - |
| dc.date.available | 2011-12-15T01:04:01Z | - |
| dc.date.issued | 2002 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=174582&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50242 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.2, [ xvi, 199 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 열전도도 | - |
| dc.subject | SiCp/Al 금속복합재료 | - |
| dc.subject | SiC 분말 예비성형체 | - |
| dc.subject | 전자패키징용 열관리 재료 | - |
| dc.subject | 열팽창계수 | - |
| dc.subject | Thermal Expansion Coefficient | - |
| dc.subject | Thermal Conductivity | - |
| dc.subject | SiCp/Al Metal Matrix Compoiste | - |
| dc.subject | SiC Particulate Preform | - |
| dc.subject | Thermal Management Materials for Elelctronic Packaging | - |
| dc.title | 전자패키징용 $SiC_p/Al$ 금속복합재료의 제조공정 및 열적특성 | - |
| dc.title.alternative | Fabrication process and thermal properties of $SiC_p/Al$ metal matrix composites for electronic packaging applications | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 174582/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000965332 | - |
| dc.contributor.localauthor | 이효수 | - |
| dc.contributor.localauthor | Lee, Hyo-Soo | - |
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