학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.2, [ xvi, 199 p. ]
열전도도; SiCp/Al 금속복합재료; SiC 분말 예비성형체; 전자패키징용 열관리 재료; 열팽창계수; Thermal Expansion Coefficient; Thermal Conductivity; SiCp/Al Metal Matrix Compoiste; SiC Particulate Preform; Thermal Management Materials for Elelctronic Packaging
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