전자패키징용 $SiC_p/Al$ 금속복합재료의 제조공정 및 열적특성 = Fabrication process and thermal properties of $SiC_p/Al$ metal matrix composites for electronic packaging applications

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Advisors
홍순형researcherHong, Soon-Hyungresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
2002
Identifier
174582/325007 / 000965332
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.2, [ xvi, 199 p. ]

Keywords

열전도도; SiCp/Al 금속복합재료; SiC 분말 예비성형체; 전자패키징용 열관리 재료; 열팽창계수; Thermal Expansion Coefficient; Thermal Conductivity; SiCp/Al Metal Matrix Compoiste; SiC Particulate Preform; Thermal Management Materials for Elelctronic Packaging

URI
http://hdl.handle.net/10203/50242
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=174582&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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