구리 기초 리드프레임의 저온 산화와 Cu/EMC 계면 접착에 관한 연구A study on the low temperature oxidation of Cu-base leadframe and Cu/EMC Interface adhesion
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 백경욱 | - |
| dc.contributor.advisor | 김영길 | - |
| dc.contributor.advisor | Paik, Kyung-Wook | - |
| dc.contributor.advisor | Kim, Young-Gil | - |
| dc.contributor.author | 조순진 | - |
| dc.contributor.author | Cho, Soon-Jin | - |
| dc.date.accessioned | 2011-12-15T01:02:55Z | - |
| dc.date.available | 2011-12-15T01:02:55Z | - |
| dc.date.issued | 1997 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=128139&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50177 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 1997.8, [ v, 145 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 에폭시 몰딩 컴파운드 | - |
| dc.subject | 접착 | - |
| dc.subject | Cu-base leadframe | - |
| dc.subject | Oxidation | - |
| dc.subject | Epoxy molding Compound | - |
| dc.subject | Adhesion | - |
| dc.subject | 구리 기초 리드프레임 | - |
| dc.subject | 산화 | - |
| dc.title | 구리 기초 리드프레임의 저온 산화와 Cu/EMC 계면 접착에 관한 연구 | - |
| dc.title.alternative | A study on the low temperature oxidation of Cu-base leadframe and Cu/EMC Interface adhesion | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 128139/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000935347 | - |
| dc.contributor.localauthor | 조순진 | - |
| dc.contributor.localauthor | Cho, Soon-Jin | - |
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.