구리 기초 리드프레임의 저온 산화와 Cu/EMC 계면 접착에 관한 연구 = A study on the low temperature oxidation of Cu-base leadframe and Cu/EMC Interface adhesion

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Advisors
백경욱researcher김영길researcherPaik, Kyung-WookresearcherKim, Young-Gilresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
1997
Identifier
128139/325007 / 000935347
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 1997.8, [ v, 145 p. ]

Keywords

에폭시 몰딩 컴파운드; 접착; Cu-base leadframe; Oxidation; Epoxy molding Compound; Adhesion; 구리 기초 리드프레임; 산화

URI
http://hdl.handle.net/10203/50177
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=128139&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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