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학위논문(박사) - 한국과학기술원 : 재료공학과, 1997.8, [ v, 145 p. ]
에폭시 몰딩 컴파운드; 접착; Cu-base leadframe; Oxidation; Epoxy molding Compound; Adhesion; 구리 기초 리드프레임; 산화
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