구리의 화학증착기구에 관한 연구 = A study on the copper chemical vapor deposition mechanism using copper(I) hexafluoroacetylacetonate trimethylvinylsilane

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Advisors
박종욱researcherPark, Chong-Ookresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
1996
Identifier
108847/325007 / 000935126
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 1996.8, [ iv, 120 p. ]

Keywords

열처리; 기판전압; 화학증착; 구리; 배선재료; Interconnection; Annealing; Substrate bias; Chemical vapor deposition; Copper

URI
http://hdl.handle.net/10203/50158
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=108847&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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