구리의 화학증착기구에 관한 연구A study on the copper chemical vapor deposition mechanism using copper(I) hexafluoroacetylacetonate trimethylvinylsilane
- Advisors
- 박종욱researcher; Park, Chong-Ookresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1996
- Identifier
- 108847/325007 / 000935126
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 재료공학과, 1996.8, [ iv, 120 p. ]
- Keywords
열처리; 기판전압; 화학증착; 구리; 배선재료; Interconnection; Annealing; Substrate bias; Chemical vapor deposition; Copper
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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