DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 유진 | - |
dc.contributor.advisor | Yu, Jin | - |
dc.contributor.author | 정태경 | - |
dc.contributor.author | Chung, Tae-Gyeong | - |
dc.date.accessioned | 2011-12-15 | - |
dc.date.available | 2011-12-15 | - |
dc.date.issued | 1993 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=68191&flag=dissertation | - |
dc.identifier.uri | http://hdl.handle.net/10203/49908 | - |
dc.description | 학위논문(박사) - 한국과학기술원 : 전자재료공학과, 1993.8, [ vii, 156, [4] p. ] | - |
dc.language | kor | - |
dc.publisher | 한국과학기술원 | - |
dc.title | 전자 패키징에서 구리 박막의 접착력에 관한 연구 | - |
dc.title.alternative | A study on the adhesion of Cu thin films in microelectronics packaging | - |
dc.type | Thesis(Ph.D) | - |
dc.identifier.CNRN | 68191/325007 | - |
dc.description.department | 한국과학기술원 : 전자재료공학과, | - |
dc.identifier.uid | 000875395 | - |
dc.contributor.localauthor | 정태경 | - |
dc.contributor.localauthor | Chung, Tae-Gyeong | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.