전자 패키징에서 구리 박막의 접착력에 관한 연구 = A study on the adhesion of Cu thin films in microelectronics packaging

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Advisors
유진researcherYu, Jinresearcher
Description
한국과학기술원 : 전자재료공학과,
Publisher
한국과학기술원
Issue Date
1993
Identifier
68191/325007 / 000875395
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 전자재료공학과, 1993.8, [ vii, 156, [4] p. ]

URI
http://hdl.handle.net/10203/49908
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=68191&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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