Sn-Ag-Cu계 솔더 합금과 Cu, Ni 기판의 계면 현상 및 계면 생성물의 성장 거동에 관한 연구Studies on interfacial reaction and microstructural evolution of joint interface between Sn-Ag-Cu solder alloy and Cu, Ni substrate
- Advisors
- 이혁모researcher; Lee, Hyuck-Moresearcher
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2005
- Identifier
- 245048/325007 / 020005071
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 신소재공학과, 2005.2, [ v, 101 p. ]
- Keywords
계면 반응; Sn-Ag-Cu계; 솔더; 금속간 화합물; intermetallic compound; interfacial reaction; Sn-Ag-Cu system; solder
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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