Sn-Ag-Cu계 솔더 합금과 Cu, Ni 기판의 계면 현상 및 계면 생성물의 성장 거동에 관한 연구 = Studies on interfacial reaction and microstructural evolution of joint interface between Sn-Ag-Cu solder alloy and Cu, Ni substrate

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Advisors
이혁모researcherLee, Hyuck-Moresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2005
Identifier
245048/325007  / 020005071
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 신소재공학과, 2005.2, [ v, 101 p. ]

Keywords

계면 반응; Sn-Ag-Cu계; 솔더; 금속간 화합물; intermetallic compound; interfacial reaction; Sn-Ag-Cu system; solder

URI
http://hdl.handle.net/10203/49830
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=245048&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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