표면활성화 접합에 의한 Cu-Ni 정밀층상 복합소재의 제조공정 및 접합특성Fabrication process and bonding properties of Cu-Ni fine clad materials prepared by surface activation bonding (SAB)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 홍순형 | - |
| dc.contributor.advisor | Hong, Soon-Hyung | - |
| dc.contributor.author | 김경훈 | - |
| dc.contributor.author | Kim, Kyung-Hoon | - |
| dc.date.accessioned | 2011-12-15 | - |
| dc.date.available | 2011-12-15 | - |
| dc.date.issued | 2010 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=455397&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/49751 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2010.08, [ xi, 166 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 계면 | - |
| dc.subject | 접합 | - |
| dc.subject | 활성화 | - |
| dc.subject | 표면 | - |
| dc.subject | 정밀층상 | - |
| dc.subject | Fine Clad | - |
| dc.subject | Interface | - |
| dc.subject | Bonding | - |
| dc.subject | Activation | - |
| dc.subject | Surface | - |
| dc.title | 표면활성화 접합에 의한 Cu-Ni 정밀층상 복합소재의 제조공정 및 접합특성 | - |
| dc.title.alternative | Fabrication process and bonding properties of Cu-Ni fine clad materials prepared by surface activation bonding (SAB) | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 455397/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 020055808 | - |
| dc.contributor.localauthor | 김경훈 | - |
| dc.contributor.localauthor | Kim, Kyung-Hoon | - |
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.