표면활성화 접합에 의한 Cu-Ni 정밀층상 복합소재의 제조공정 및 접합특성 = Fabrication process and bonding properties of Cu-Ni fine clad materials prepared by surface activation bonding (SAB)

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Advisors
홍순형researcherHong, Soon-Hyungresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2010
Identifier
455397/325007  / 020055808
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 신소재공학과, 2010.08, [ xi, 166 p. ]

Keywords

계면; 접합; 활성화; 표면; 정밀층상; Fine Clad; Interface; Bonding; Activation; Surface

URI
http://hdl.handle.net/10203/49751
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=455397&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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