학위논문(박사) - 한국과학기술원 : 신소재공학과, 2008.2, [ iv, 131 p ]
via filling; IMP sputtering; Cu electroplating; seed layer; 3-D packaging; 비아 필링; IMP 스퍼터링; 구리 도금; 씨앗층; 3-D 패키징
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