정전압 하에서의 분무입자 부착 효율에 관한 연구A study on deposition efficiency of spray drops in electrostatic field
- Description
- 한국과학기술원 : 기계공학전공,
- Publisher
- 한국과학기술원
- Issue Date
- 2004
- Identifier
- 237900/325007 / 020023204
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 기계공학전공, 2004.2, [ ix, 88 p. ]
- Keywords
정전압; 액적 경로; 반발 현상; deposition efficiency; spray; electrostatic field; drop trajectrories; bouncing phenomenon; 부착 효율; 분무
- Appears in Collection
- ME-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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