Residual stress and mechanical properties of submicron thin film on polymer substrate = 폴리머 모재 위의 서브마이크론 박막의 잔류응력과 기계적 물성

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Thin films on polymer substrates have been used in the electronic packaging applications and employed as specimens for material tests to study the mechanical properties of thin films. Residual stress and mechanical properties of a thin film on a polymer substrate are considered in this research. Especially, initial residual stress reduction in the film is studied due to the mismatch strain distribution in the film and the substrate. Exact mismatch strains in the film and the substrate are obtained and the effect of mismatch strain distribution on the curvature-mismatch strain relationship is analyzed. F.E simulation is performed to see the stress and curvature distributions during temperature changes. Estimation of residual stress of film by mismatch strain in the film is suggested. Tensile test machine was set up to investigate material properties and behaviors of a submicron copper film on a Kapton substrate. Alignment, gripping and the specimen geometry effect on the tensile test result are considered. Dependency of mechanical properties on the thickness is studied. Residual stresses are accounted fot the yield stress of the film. In addition, mechanical behaviors during elongation, such as, crack formation, saturation, buckling and delamination are observed using microscope and AFM.
Advisors
Lee, Soon-Bokresearcher이순복researcher
Description
한국과학기술원 : 기계공학전공,
Publisher
한국과학기술원
Issue Date
2005
Identifier
249566/325007  / 020033099
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 기계공학전공, 2005.8, [ vi, 67 p. ]

Keywords

mechanical properties; Residual stress; thin film; 박막; 기계적 물성; 잔류응력

URI
http://hdl.handle.net/10203/45455
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=249566&flag=dissertation
Appears in Collection
ME-Theses_Master(석사논문)
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