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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12 |
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