Browse "EE-Journal Papers(저널논문)" by Subject via

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1
Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model

Pak, Jun So; Kim, Hyungsoo; Lee, Junwoo; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.73 - 85, 2007-02

2
Modeling and measurement of simultaneous switching noise coupling through signal via transition

Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08

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