Browse "EE-Journal Papers(저널논문)" by Subject system-in-package (SiP)
Showing results 1 to 3 of 3
| A 60-GHz LTCC SiP with Low-Power CMOS OOK Modulator and Demodulator Byeon, Chul-Woo; Lee, Jae-Jin; Kim, Hong-Yi; Song, In-Sang; Cho, Seong-Jun; Eun, Ki-Chan; Lee, Chae-Jun; et al, JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v.11, no.4, pp.229 - 237, 2011-12 |
| Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications Park, J; Lu, ACW; Chua, KM; Wai, LL; Lee, J; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.481 - 483, 2006-09 |
| Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08 |
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