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An autonomous SRAM with on-chip sensors in an 80-nm double stacked cell technology Sohn, K; Mo, HS; Suh, YH; Byun, HG; Yoo, Hoi-Jun, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.41, pp.823 - 830, 2006-04 |
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02 |
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