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| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
| Optical characterization of high speed scanning micromirrors with vertical combdrives Wada, H; Lee, D; Yu, Kyoungsik; Krishnamoorthy, U; Solgaard, O, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.41, no.10B, pp.1169 - 1171, 2002-10 |
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